MECHANIC BGA Solder Paste Tin Rosin-Based Flux Paste Cream

High synthetic BGA Solder Flux Paste BGA Soldering Tin Cream. Applicable to PCB, BGA, SMD, PGA repair repair, Soldering Repair cream Solder Paste Welding Fluxes for Soldering Station Tin Cream Welding Seal Grease Tools.Features:1. High bond strength. PH value neutral, insulation is strong, welding surface smooth.2. IC and PCB for no corrosive.3. Its boiling point only slightly higher than the melting point of the solder.4. For mobile phones, PC cards, BGA, SMD, PGA and other sophisticated electronic chip-level help welding.Instructions:1. Wipe the surface of the object before soldering.2. Apply the paste flux to the solder joint.3. Solder the tin to the solder joint with soldering iron.MECHANIC advanced paste flux soldering for mobile phone motherboard repair. Electric soldering iron welding fluxes for phone circuit board repair.High bond strength. PH value neutral, insulation is strong, welding surface smoothIC and PCB for no corrosive.Its boiling point only slightly higher than the melting point of the solder.For mobile phones, PC cards and other sophisticated electronic chip-level help welding.Option Model:Option 1: MCN-UV50Option 2: MCN-UV80