PHONEFIX Car Chip Thermal Paste Phone CPU Heat Sink Grease
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PHONEFIX Car Chip Thermal Paste Phone CPU Heat Sink Grease

$1.99
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Phonefix Phone chip heat Thermal Paste sink compound for mobile phone laptop computer BGA semiconductor repair. Phonefix CPU thermal grease to maximize heat transfer and dissipation, used to improve thermal coupling between different components such as power transistors, CPU, GPU and LED COB, etc.Features:1. High and Low Temperature Resistant: -50℃ to 220℃.2. Metal-Free, Electrical Insulation, Corrosion Resistance, Non-Damaging to Electronic Devices.3. Rapid Cooling, Lasting Cooling Sensation. High Thermal Conductivity Silicone Gel that fills microscopic gaps and conducts heat quickly.4. It offers high thermal conductivity, stable performance, and insulation safety with three options available.Pleaste note: Paste flux can only be sent out by special post mail.Specifications:Product Name: Mobile Phone Thermal PasteThermal Conductivity: 4W/6W/8.5WMKThermal Resistance: 0.05°C-cm2Density: 3.0Viscosity: 350Pa·SDielectric Strength: 10KvColors: Pink/Blue/GreyNet Weight: 30g/40g/40gShelf Life:

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