QCOM MT PM MAX MT Power IC BGA Reballing Stencils Template
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QCOM MT PM MAX MT Power IC BGA Reballing Stencils Template

$2.50
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Amaoe QCOM MT PM MAX MT Power IC BGA Stencils Template 0.12mm Direct Heating Mesh For Motherboard Soldering Repair. Phonefix BGA reballing stencils QCOM MT PM MAX MT power IC reballing For mobile phone motherboard chip repair.Amaoe Power IC BGA reballing stencils template for QCOM MT PM MAX MT power IC repair net, MAX77833 MAX98925 MAX77836 MAX77818 MAX77803 MAX77888 power IC BGA reballing stencils net, For PM8018 PM8926 PM8996 PMI8996 PM8956 PM8941 BGA soldering stencil direct heating template 0.12mm thickness, PM8019 PM8953 power IC BGA reballing stencils steel mesh net, MT6325V MT6290MA MT6261MA MT6322 MT6329 MT6353V power IC BGA reballing stencils.Product Specifications :Item name: BGA Reballing Stencil TemplateModel: PM:1 / PM:2 / MT:1 / MT:2 / MAX:1Material: Imported Japan steel sheetColor: As pictures showThickness: 0.12mmDesign: Heat dissipating holes designUnit Type: PieceSuitable for: for general rework stationFunction: for phone BGA reballingOption 1: PM:1Option 2: PM:2Optio

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