Qualcomm CPU BGA Reballing Stencil Template MSM8994 MSM8974
$2.50
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Qualcomm BGA reballing stencils template MSM8994 MSM8974 MSM8960 for phone CPU motherboard soldering repair. high quality 0.12mm Reballing Stencil Template for universal solder rework station.MSM8994 A (B) / MSM8974 A(B) / MSM8960 A(B) BGA reballing stencil template, it will give you best repair experience for Mobile phone soldering and BGA reballing works.Qualcomm CPU BGA Reballing Stencil Template MSM8994 MSM8974MSM8974 is universal for 8274 / 8674Product Features :1. 100% Brand New.2. BGA stencil for reballing pins for MSM8994 MSM8974 MSM8960 ( 0.12mm thickness )
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