WDS-700 Automatic infrared PCB BGA soldering BGA rework station

WDS-700 Optical alignment system BGA rework station for mobile phone motherboard BGA welding soldering repair, WDS-700 automatic infrared BGA rework station for mobile phone circuit board BGA welding repair. WDS-700 BGA rework station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after-sales service and rework. How to separate BGA chip from motherboard / How to replace a new BGA chip Repair steps: 1:  Separate the BGA chip from mother board -we called desoldering.2:  Clean Pad.3:  Reballing  or replace a new BGA chip directly.4:  lignment/Positioning -Depend on experience ,silk frame ,optical camera.5:  replace a new BGA chip - we called Soldering.user manaul and technical parameters: https://drive.google.com/file/d/1YPxRbdjkTAQIHVKoBLdJozCTU79koMJy/view?usp=sharing