WL BGA Reballing Stencil for iphone 6 7 8 X XS NAND Baseband
WL NAND BGA ball planting stencil with black positioning mold for iPhone motherboard repair. WL Top Quality Fast BGA Reball Solder Stencil with Black Positioning Die for iPhone 6-12 Pro Max NAND Baseband Soldering Repair.Product Introduction:Quality is very good.Magnetic base + positioning plate + tin mesh ( Together to use ).WL BGA reballing stencils kit come with black positioning mold.WL high accuracy BGA reballing stencils template for iPhone 5S 6 6P 7 8 X XS Max NAND and Baseband soldering repair.0.12mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing solder working, it is the top quality BGA reballing stencil for iPhone CPU and NAND, for 6 6P 6S 6SP 7 7P 8 8P X XR XS XS Max.Notice:Black positioning mold with fixed plate, easy to use and more accurate CPU IC welding position.The Black Positioning Mold just match with the right BGA Reballing Stencil.Option Aluminum Mold Base: it is universal, can fit with any black positioning mold, ( Choose different package ), and just 1pcs aluminum mold base, easy for your working, and also save moneyOption Positioning Mold - Black: Not universal, can't working with different BGA reballing stencil, need the right model BGA reballing stencil, the black positioning mold just match with the right BGA reballing stencil.Optional Types:Option 1: iPhone 5/5S Baseband and NANDOption 2: iPhone 6/6P Baseband and NANDOption 3: iPhone 6S/6SP Baseband and NANDOption 4: iPhone 7/7P Baseband and NANDOption 5: iPhone 8/8P/X Baseband and NANDOption 6: iPhone XS MAX XR Baseband and NANDOption 7: iPhone 11-11PRO MAX Baseband and NANDOption 8: iPhone 12-12 Pro Max Baseband and NAND