BGA Rework Station T-862++ for components chips ≤35mm desolder
$200.00
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Infrared heating without air flow. Won't impact perimeter small components. Can desolder all of the SMD components,especially Micro BGA components. Repair chips size 15x15-35x35 mm Rated voltage and frequency AC220V/AC110V 60/50Hz Complete machine power 800W Range of IR Temp 100-350℃ Range of 936 Iron Temp 200-450℃ Preheating plate size 120x120mm Range of Preheating plate Temp 60-200℃
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