0.008mm 50M/200M Silver Jumper Wire for Mobile Phone Motherboard Chip Welding Repair PCB Repair Link Wire Soldering Tool

    0.008mm 50M/200M Silver Jumper Wire for Mobile Phone Motherboard Chip Welding Repair PCB Repair Link Wire Soldering Tool   Description: Mobile Phone Motherboard Repair BGA Desoldering wire Absorption wire Soldering Accessory assistant for removing unwanted solder Quickly. Sucking line BGA Desoldering Solder Wire BGA Tin Absorption line. Desoldering Wire Solder wick Except for the tin absorbing excess solder. Silver BGA Desoldering wire - Quickly removes unwanted solder When used with a soldering iron, improve Your mobile phone PCB Desoldering Process.   Features: High efficiency and save the electric repairing time. Avoid the high temperature destruction of electric pad. Design in precision,guarantee the max surface tension and the ability of absorbing tin. Speed up the speed of absorbing tin and low residue of flux. Increase the speed of cleaning the PCB pad. Oxidation resistivity and anti-corrosion prote