3D01200 - SEMI 3D12 - Guide for Measuring Flatness and Shape of Low Stiffness Wafers

This Guide is designed to provide definitions for describing a more suitable measurement strategy for low stiffness wafers and geometries. The more suitable measurement process consists of an alternative mounting for wafers with high aspect ratios and the use of high resolution measurements. This Guide also provides a measurement procedure for local bow, which denotes small areas of imperfection of the otherwise flat wafer or substrate. This Guide’s alternative measurement process is suitable for use in materials acceptance and process control, but may also be useful in other applications, such as wafer design and production.This Guide is intended in general for metrology on low stiffness substrates like wafers or other geometrical shapes such as panels. As low stiffness can occur with any material, this Guide can be applied to all materials that show low stiffness in certain deformation modes. This Guide applies in particular to glass and silicon wafers with a diameter equal to or exc