M04000 - SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers

 This Guide incorporates the following methodologies: Standardized scan patterns for both local and full-area surface characterization,A set of roughness abbreviations that describe measurement conditions in a short-hand code, andReference test methodologies for three generic types of roughness measuring instruments. These general categories may include, but are not limited to:• Profilometers — AFM and other scanning probe microscopes; optical profilometers; high-resolution mechanical stylus systems,• Interferometers — Interference microscopes, and• Scatterometers — Total integrating scatterometers (TIS), angle-resolved light scatterometers (ARLS), scanning surface inspection systems (SSIS). Procedures to obtain a representative value of roughness for a surface are specified. Roughness nomenclature is intended to remove ambiguities with respect to identifying the roughness measurements used and the results achieved. Referenced SEMI Standards (purchase separately)SEMI E89 — Guide for Me