3D01500 - SEMI 3D15 - Guide for Overlay Performance Assessment for 3DS-IC Process

This Guide will assist the user in conducting the overlay performance assessment for the face to back (F2B) and face to face (F2F) wafer in 3DS-IC process. A generic overlay performance assessment specification will be addressed in order to provide criteria and common baselines of the middle-end process for related upstream and downstream manufacturers fabricating the 3DS-IC products.This Guide will provide a generic optical measurement methodology and linear dimensional parameters such as translation, expansion, rotation, residue errors and vector plots for overlay performance assessment in 3D-IC middle end process quality control. It includes generic overlay target design methodology, instrument configuration, theoretical model and measurement algorithm consideration for F2F and F2B wafer in 3D-IS process. It focuses on the various measurement methods available, rather than on particular instruments. This Guide does not provide an exhaustive list of the state of the art of overlay me