3D02100 - SEMI 3D21 - Guide for Describing Glass-Based Material for Use in 3DS-IC Process

 1  Purpose1.1  With their unique properties and features, non-silicon, dielectric materials have proven to be a valuable alternative to silicon in the semiconductor and 3DS-IC packaging industry. Such non-silicon substrates used as carrier wafers, spacers, interposers, MEMS, RF devices, and lenses. However, until now, little information about the features and characteristics of such base materials was available to the industry.1.2  The non-silicon base material can be further processed to a substrate, which may have through vias, blind vias, and other shaped openings. With vias filled, the substrate may become an interposer. Finally, such substrates may remain in the package in a permanently bonded state or may be removed at the end of the process, such as carrier wafers.1.3  This Guide closes the gap described in ¶ 1.1 and serves as an umbrella document for more specific specifications.1.4  Thereby this Guide enables and describes glass as a base material or substrate of choice for t