3D01700 - SEMI 3D17 - Specification for Reference Material for Bonded Wafer Stack Void Metrology

 This Specification describes requisite test structures, including design, manufacturing, and certification procedure for a bonded wafer reference sample composed of two wafers. Referenced SEMI Standards (purchase separately)SEMI 3D13 — Guide for Measuring Voids in Bonded Wafer StacksSEMI M20 — Practice for Establishing a Wafer Coordinate System Revision HistorySEMI 3D17-1123 (technical revision)SEMI 3D17-1217 (first published)