3D02000 - SEMI 3D20 - Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications

Panel level packaging (PLP) is projected to become a critical packaging process. This Specification identifies the physical properties that must be specified for the semiconductor industry to produce an equipment set for successful implementation of PLP. Many of the applications for panel packaging lines include fan-out technology applications. To permit common processing equipment, standardized panel (largest external) dimensions (whether with or without process carrier) are essential. As this technology has developed, numerous panel sizes, thickness, warpage, and mass are being investigated delaying the introduction of the technology and requiring customization of equipment and processes for each panel type. This Specification focuses on panel (largest external) dimensions (with or without process carrier), panel thickness, warpage, and mass, for use in PLP applications. The