E08400 - SEMI E84 - Specification for Enhanced Carrier Handoff Parallel I/O Interface

 Due to the migration to large wafer sizes, future semiconductor factories will use extensive automated material handling systems (AMHS) to transfer wafer carriers, including FOUPs and open cassettes, of increasing weight. The parallel input/output (PI/O) control signals between the production equipment and the AMHS must be better defined for more reliable and efficient carrier handoffs (load/unload) at production equipment load ports.　The purpose of this Specification is to enhance the capabilities of the parallel I/O interface defined in SEMI E23 in order to support improvements in the reliability and efficiency of carrier transfer. The enhanced capabilities include continuous handoff, simultaneous handoff, and the capabilities of error detection on the interface. The scope of this Specification is limited to communications associated with the material handoff operations between the active equipment (e.g., AMHS equipment including AGV, RGV and OHT) and the passive equipment (e.g., pr