G03600 - SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling
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This document is for the ordering of tooling required to mold and form plastic high density TAB quad semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end-of-line toolmakers as the basis for defining the limits of manufacturing tolerances.　Referenced SEMI StandardsNone.
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