G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling

This document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end-of-line toolmakers as the basis for defining the limits of manufacturing tolerances.　Referenced SEMI StandardsNone.