M04300 - SEMI M43 - Guide for Reporting Wafer Nanotopography

 This Guide provides a framework for reporting of nanotopography surface features on silicon wafers. This Guide addresses reporting the characterization of nanotopography surface features found on wafer surfaces. Nanotopography is the non-planar deviation of the whole front wafer surface within a spatial wavelength range of approximately 0.2 to 20 mm and within the fixed quality area (FQA). Typical examples include dips, bumps or waves on the wafer surface that vary in peak to valley height from a few nanometers to a several hundred nanometers. This Guide provides a framework for communicating specific values limiting feature levels and/or densities as agreed upon between suppliers and users. It is intended to apply to polished wafers as specified in SEMI M1. Although nanotopography measurements have not been needed for 0.25 µm generation devices, they are expected to be required for smaller feature sizes to meet CMP requirements. Nanotopography on a wafer surface prior to CMP processe