M04900 - SEMI M49 - 130 nmから65 nmへの技術世代のシリコンウェーハ用ジオメトリ測定システム規定のためのガイド

M04900 - SEMI M49 - 130 nmから65 nmへの技術世代のシリコンウェーハ用ジオメトリ測定システム規定のためのガイド

$224.00
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本ガイドはInternational Technology Roadmap for Semiconductors: 1999 edition (ITRS)によって予測され,主要半導体デバイスメーカーが計画している,130,90,65 nm技術世代のシリコンウェーハのジオメトリおよび平坦度についての測定システムを規定するための推奨事項を提供するものである。SEMI M1,SEMI M8,SEMI M11,SEMI M24,SEMI M38に定義されているウェーハのパラメータは,シリコンウェーハ・サプライヤにとっては顧客によって指定され,通常適合性証明の一部となる。シリコンウェーハ・サプライヤおよび顧客は,これらのパラメータを,異なるメーカーの装置を使用するか,あるいは同じサプライヤでも異なる世代の装置を使用して測定することがある。測定システムの基本的な特徴および能力に関する合意は,適切なシステムの調達と同様,データ交換およびデータ解釈を改善する。 Referenced SEMI Standards SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm WafersSEMI E5 — Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II)SEMI E10 — Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and UtilizationSEMI E19 — Specification for Standard Mechanical Interface (SMIF)SEMI E30 — Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)SEMI E37 — High Speed SECS Message Services (HSMS) Generic ServicesSEMI E47 — Specification for 150 mm/200 mm Pod HandlesSEMI E47.1 — Mechanical Specification for FOUPS Used to Transport and Store 300 mm WafersSEMI E58 — Automated Reliability, Availability, and Maintainability Standard (ARAMS): Concepts, Behavior, and ServicesSEMI E89 — Guide for Measurement System Analysis (MSA)SEMI E158 — Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450 FOUP) and Kinematic CouplingSEMI E159 — Mechanical Specification for Multi Application Carrier (MAC) Used to Transport and Ship 450 mm WafersSEMI M1 — Specification for Polished Single Crystal Silicon WafersSEMI M8 — Specification for Polished Monocrystalline Silicon Test WafersSEMI M12 — Specification for Serial Alphanumeric Marking of the Front Surface of WafersSEMI M13 — Specification for Alphanumeric Marking of Silicon WafersSEMI M24 — Specification for Polished Monocrystalline Silicon Premium WafersSEMI M31 — Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm WafersSEMI M38 — Specification for Polished Reclaimed Silicon WafersSEMI M43 — Guide for Reporting Wafer NanotopographySEMI M59 — Terminology for Silicon TechnologySEMI M62 — Specification for Silicon Epitaxial WafersSEMI M67 — Practice for Determining Wafer Near-Edge Geometry from a Measured Thickness Data Array Using the ESFQR, ESFQD and ESBIR MetricsSEMI M68 — Practice for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDDSEMI M73 — Test Methods for Extracting Relevant Characteristics from Measured Wafer Edge ProfilesSEMI M80 — Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm WafersSEMI MF42 — Test Method for Conductivity Type of Extrinsic Semiconducting MaterialsSEMI MF84 — Test Method for Measuring Resistivity of Silicon Wafers with an In-Line Four-Point ProbeSEMI MF534 — Test Method for Bow of Silicon WafersSEMI MF657 — Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact ScanningSEMI MF671 — Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic MaterialsSEMI MF673 — Test Method for Measuring Resistivity of Semiconductor Wafers or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current GaugeSEMI MF928 — Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk SubstratesSEMI MF1152 — Test Method for Dimensions of Notches on Silicon WafersSEMI MF1390 — Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact ScanningSEMI MF1451 — Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact ScanningSEMI MF1530 — Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact ScanningSEMI MF2074 — Guide for Measuring Diameter of Silicon and Other Semiconductor WafersSEMI T7 — Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol

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$224 (+$9.01)