P04700 - SEMI P47 - Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness

This Standard was technically approved by the Microlithography Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on February 6, 2013. Available at www.semiviews.org and www.semi.org in May 2013; originally published March 2007. 　 NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. 　 NOTICE: This Document was reapproved with minor editorial changes. 　 The purpose of this Document is to identify standard procedures for calculating the indices for the following two kinds of line roughness to characterize materials and processes for fine line pattern fabrication, especially in the integrated circuit manufacturing environment. The first index is related to the deviation of actual line-edge position from the ideal one (line of best fit) and is called