T00700 - SEMI T7 - Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol

This Specification is intended to provide a marking symbology that can be used to mark silicon wafers with minimal intrusion into the fixed quality area of the wafer.This Specification defines the geometric shape, size and content (including the error checking and correcting code) of a rectangular two-dimensional (2D), machine-readable, binary data matrix code symbol for back surface marking of double-side polished silicon wafers with diameters of 300 mm and 450 mm that comply with SEMI M1. Although this Specification does not specify the marking techniques that may be employed when complying with its requirements, it is assumed that the symbol is obtained by laser scribing individual dots. The matrix code is applicable to a broad range of wafer products including epitaxial wafers, SOI wafers, and unpatterned or patterned polished wafers. The format and algorithms of this code are based on two-dimensional symbology specified in ISO/IEC 16022. Referenced SEMI Standards (purchase separately)SEMI M1 — Specification for Polished Single Crystal Silicon WafersSEMI M12 — Specification for Serial Alphanumeric Marking of the Front Surface of Silicon Wafers Revision HistorySEMI T7-0516 (Reapproved 0322)SEMI T7-0516 (technical revision)SEMI T7-0415 (technical revision)SEMI T7-0303 (Reapproved 0709)SEMI T7-0303 (technical revision)SEMI T7-1102 (technical revision)SEMI T7-0302 (technical revision)SEMI T7-0997E3 (editorial revision)SEMI T7-0997E2 (editorial revision)SEMI T7-0997E (editorial revision) SEMI T7-0997 (first published)