AIM WS488-SAC305-88.5-T4 Lead Free Water Soluble Solder Paste, 500 Gram Jar
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AIM WS488-SAC305-88.5-T4 Lead Free Water Soluble Solder Paste, 500 Gram Jar

$109.00
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ul { list-style-type: disc; /* Or 'circle', 'square', 'none' */ padding-left: 0; /* Remove default padding */ margin-left: 0.25em; /* Adjust this value to control the bullet's position */ } li { text-indent: -1.5em; /* Negative indent to pull the first line (and bullet) left */ margin-left: 1.5em; /* Positive margin to push the rest of the lines right */ } AIM WS488-SAC305-88.5-T4 Lead-Free Water Soluble Solder Paste – 500g Jar Water-soluble solder paste engineered for high-reliability applications requiring post-solder cleaning. AIM formulated WS488 Water Soluble Solder Paste to deliver robust wetting capabilities, specifically targeting challenging surfaces, components, and assemblies. WS488 provides a long stencil life, superior slump resistance, and a wide process window, ensuring optimal performance during soldering processes. After reflow, WS488 post-reflow residues

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