AIM WS488-SN63/PB37-T4 Water Soluble Solder Paste, 500 Gram Jar

The  AIM WS488-SN63/PB37-T4 Water Soluble Solder Paste is a top-quality, leaded solder paste engineered for reliable performance in high-volume and precision electronic manufacturing. Designed with AIM’s advanced flux chemistry, this solder paste delivers excellent wetting, printability, and residue removal — ideal for applications demanding consistency and residue-free solder joints. AIM formulated WS488 Water Soluble Solder Paste to deliver robust wetting capabilities, specifically targeting challenging surfaces, components, and assemblies. WS488 provides a long stencil life, superior slump resistance, and a wide process window, ensuring optimal performance during soldering processes. After reflow, WS488 post-reflow residues are easily cleaned with DI water, especially under low-standoff devices. This simplifies the cleaning process and helps maintain a high level of reliability in the final assembly. WS488 is available with T4 powder, but it is also compatible with finer powders, ma