AIM WS483-SN63/PB37-T4 Water Soluble Solder Paste, 250 Gram Jar

AIM WS483 Solder Paste is a Halide-free, water-soluble solder paste designed for high-reliability SMT assembly using Sn63/Pb37 eutectic alloy. Product Features: Humidity & Heat Resistant: Maintains performance in challenging environments. High Tack & Slump Resistance: Ensures consistent stencil printing results. Extended Cleaning Window: Allows flexible post-reflow cleaning with minimal residue concerns. Non-Foaming Residue: Optimized for use with high-pressure aqueous cleaning systems. Eutectic Alloy: Sn63/Pb37 provides a sharp melting point at 183°C for reliable reflow. Halide-Free Chemistry: Promotes environmental and equipment safety. Product Specifications: Brand: AIM Solder Part Number: WS483-SN63/PB37-T4 Alloy Composition: Sn63/Pb37 (63% Tin / 37% Lead) Flux Type: Water Soluble Powder Size: T4 (20–38 microns) Flux Content: Approximately 11.5% Package: 250 gram (8.8 oz) jar Lead-Free: No RoHS Compliant: No Ideal For: Standard and fine-pitch SMT assembl