0.12MM Qualcomm CPU BGA Reballing Stencil Template MSM8928
$2.50
{{option.name}}:
{{selected_options[option.position]}}
{{value_obj.value}}
PHONEFIX Qualcomm High Quality 0.12mm MSM7225A/ MSM8928 B/ MSM8928 A/ MSM8909/ MSM8940(MSM8937)/ MSM8952/ MSM8612/ SDM660 Qualcomm CPU BGA Ball Attachment Stencil. Qualcomm CPU BGA Ball Attachment Stencil. Qualcomm 0.12mm CPU BGA Reball Stencil MSM8928 MSM8909 Stencil for Mobile Phone Soldering Repair. 0.12MM Qualcomm CPU BGA Reballing Stencil Template MSM8928 MSM8909 MSM8928 is universal for 8926/ 8228/ 8628/ 8626/ 8526 MSM7225A is universal for 7227A/ 7625A/ 7627A/ 8225/ 8225Q/ 8625/ 8625Q MSM8940 is universal for 8937/ 8917 Imported steel and professional mobile phone welding and repair cooling holes are used to provide the best repair experience for professional mobile phone welding and reballing operations.
Show More
Show Less