Amaoe Steel Net Huawei Xiaomi BGA IC Reballing Stencil
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Amaoe Steel Net Huawei Xiaomi BGA IC Reballing Stencil

$2.55
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Universal 0.15mm Amaoe BGA Reballing Stencil EMMC1 EMMC2 EMMC3 steel mesh for Android phone repair. Amaoe EMMC EMCP Font UFS UMCP LPDDR NAND PCIE BGA Reballing Stencil for Android phones repair. Universal BGA Reballing Glue Removal Platform With 56pcs stencils For EMMC, iOS CPU, Font, Qualcomm, Hisilicon, MediaTek CPU series ICs, ect.Option:1. EMMC:1 stencil: For Android BGA221 BGA153 BGA169 BGA254 BGA162 BGA186 EMCP EMMC Font. EMMC:1 is discontinued, EMMC:3 is a replacement.2. EMMC:2 stencil: For Android Hard Disk EMMC EMCP UFS Nand Flash.3. EMMC:3 stencil: For Android EMMC EMCP UFS UMCP LPDDR NAND PCIE BGA152 BGA153 BGA169 BGA221 BGA186 BGA297 BGA254 BGA178 BGA220 BGA110 BGA60 BGA70.4. Universal BGA Reballing Glue Removal Platform With 56pcs stencils set.Features:1. Brand New.2. BGA stencil for reballing pins for MPC5554MZP132 BGA Stencil Car PC Board Controller IC Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel MeshAdvantage:1. Deformation resistant material2. Pr

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