
Syringe 10CC RL-403 Solder Paste Flux 183℃ no-clean Repair soldering
Syringe 10CC RL-403 High quality Solder Paste Flux, RELIFE RL-403 Soldering Paste Tin Sn63/Pb67 20-38um For Phone motherboard BGA soldering repair. Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding.Specification:Name: Relife RL-403 183℃ solder paste (syringe)Specifications: 10ccAlloy: Sn63/Pb37Microns: 20-38umFeatures:Good adhesion. Paste delicate, particles small, only 20~38 microns.Excellent wettability. After opening, the surface remains moist for 36 hours. Does not affect the welding.Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy moldingApplication: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃/forming fast and easy to weld conductive.Note: Solder paste flux, liquid and rosin can only be sent by special post mail.