3D01600 - SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging

This Specification is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure glass as base material to be used in a 3DS-IC process or in similar applications. Such glass may be specified with or without openings for through glass vias (TGV) or blind vias (BV). This Specification describes dimensional and thermal characteristics of glass base material for interposers, RF devices, and other similar packaging substrates. This Specification also applies to openings in glass. The glass substrate is in shape of a wafer (round) or a panel (square or rectangular). If present, the openings of the glass substrate may be intended to be further processed with metal fillings. The glass substrate is intended to remain permanently in the package or device. Methods of measurements suitable for determining the characteristics in this Specification are indicated. Referenced SEMI Standards (purchase separately)SEMI 3D7 — Guide for Alignment Mark for