E07200 - SEMI E72 - Specification and Guide for Equipment Footprint, Height, and Weight

This Standard was technically approved by the Physical Interfaces & Carriers Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 31, 2016. Available at www.semiviews.org and www.semi.org in October 2016; originally published in 1998; previously published March 2005.   NOTICE: This Document was completely rewritten in 2016 　 To help semiconductor device manufacturers plan or retrofit their fabs, this Standard provides equipment suppliers with definitions and limitations on the footprint occupied by production equipment during operation, height, weight, and the areas needed for maintenance and service. 　 Equipment suppliers need to know what limitations there are for equipment configurations and for moving equipment into facilities in order to design their products. 　 This Standard specifies limits on the footprint, height, and weight of production equipment for wafers of 300 mm or greater diameter. Separate l