G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling
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This document is prepared to enable standard measurement techniques to be used. It is intended that the measurement techniques described in the specification will apply to all molded plastic package tooling (i.e., DIPS, SIPS, PCC, SO, Quad, and TAB). Referenced SEMI StandardsSEMI G14 — Plastic Molded DIP Tooling SEMI G16 — Plastic Chip Carrier Tooling SEMI G36 — Plastic Molded High Density TAB Quad Tooling SEMI G37 — Plastic Molded SO Package Tooling
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