0.12MM MTK MT Series Power IC BGA Reballing Stencil Template
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0.12MM MTK MT Series Power IC BGA Reballing Stencil Template

$2.50
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PHONEFIX 19 in 1 MTK MT Series Power IC BGA Reballing Stencil Template, 0.12MM MTK phones power IC Repair BGA Rework Reballing Stencil Template kit, with imported steel material and heat dissipating holes for professional soldering rework repairs. MT6311P MT6339A MT6155A MT66280P power IC BGA Reballing Stencil Template, it will offer the best solution for mobile phone rework repairs.Product Specifications :Item name: BGA Reballing Stencil Template100%: High qualityMaterial: Imported Japan Steel SheetColor: As Pictures ShowType: Amaoe Universal BGA Reballing TemplateModel Number: For MT6339A Tin Plant Stencil TemplateThickness: 0.12mmDesign: Heat Dissipating Holes DesignApplication: For MT6339A Universal Phone BGA Reballing Soldering RepairUnit Type: PieceSuitable for: for General Rework StationFunction: for Phone BGA Reballing Package includes :1pcs x BGA Reballing Stencil

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