MTK Power IC BGA Reballing Stencil Template MT6325V MT6329
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MTK Power IC BGA Reballing Stencil Template MT6325V MT6329

$2.50
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0.12mm MTK MT Power IC BGA Reballing Stencil Template, MTK mobile phones power IC chips bga reballing assistant, with imported steel material and heat dissipating holes for professional mobile phone soldering and repair. MTK MT series MT6325V MT6290MA MT6261MA MT6322 MT6329 MT6352V MT6311DP reballing stencil will give the best experience for cell phone soldering and reballing repairs.Features :1. Imported Japan Amaoe for universal phone BGA Reballing Stencil Template, 100% new brand and high quality.2. Super thin thickness, just 0.12mm, easy to use.3. Professional Tin plant steel mesh for MT6325V universal upper lower layer soldering repair.4. Special designed: Heat dissipating holes design.5. High quality steel material, can work great with any universal phone repair BGA rework station.6. Can work great with any universal phone repair BGA rework station MTK CPU series Tin plant net .7. Offer the best BGA Repair solution for phone heating repair.Package includes :1pcs x BGA Reballing Stencil

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