Maxim MAX Series Power IC BGA Reballing Stencils Template

PHONEFIX 21 in 1 Maxim MAX Power IC BGA Reballing Stencils Template, mobile phone BGA chip repair fix reballing assistant, MAXIM MAX power IC BGA rework reballing template for rework station. MAX77833 MAX98925 MAX77836 21pcs models BGA Reballing Stencils Template, it will offer the best solution for MAX power chip repairs.Features:1. Imported Japan Amaoe for universal phone BGA Reballing Stencil Template, 100% new brand and high quality.2. Super thin thickness, just 0.12mm, easy to use.3. Professional Tin plant steel mesh for MAX77833 universal upper lower layer soldering repair.4. Special designed: Heat dissipating holes design.5. High quality steel material, can work great with any universal phone repair BGA rework station.6. Can work great with any universal phone repair BGA rework station MTK CPU series Tin plant net .7. Offer the best BGA Repair solution for phone heating repair.Package includes:1pcs x BGA Reballing Stencil